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福鼎通訊 電磁無(wú)源貼片蜂鳴器3V SMD050020F頂發(fā)音 常州廠家供應(yīng)
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單價(jià): 2.20
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詳細(xì)信息
加工定制 貨號(hào) SMD-050020F-03040N 品牌 福鼎
型號(hào) SMD-050020F 種類(lèi) 蜂鳴器(片) 驅(qū)動(dòng)方式 電磁式
是否有源 無(wú)源 材質(zhì) LCP 規(guī)格尺寸 10*3.2(mm)

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DEscriptION
  廠家直銷(xiāo) 高分貝電磁無(wú)源貼片蜂鳴器3V SMD-050020頂發(fā) 福鼎
描述

A. SCOPE 
This specification applies magnetic buzzer, SMD-050020F-03040N

B. SPECIFICATION

No.

Item

Unit

Specification

Condition

1

Oscillation Frequency

Hz

4000

Vo-p=1/2duty , square wave

2

Operating Voltage

Vo-p

2 ~ 4

 

3

Rated Voltage

Vo-p

3

 

4

Current Consumption

mA

MAX. 110

at Rated Voltage

5

Sound Pressure Level

dB

MIN. 75

at 10cm at Rated Voltage

6

Coil Resistance

Ω

12±3

 

7

Operating Temperature

-20 ~ +70

 

8

Storage Temperature

-30 ~ +80

 

9

Dimension

mm

5.0 x 5.0 x H2.0

See appearance drawing

10

Weight (MAX)

gram

0.1

 

11

Housing Material

 

LCP( Black )

 

12

Leading Pin

 

 Tin Plated Brass(Sn)

See appearance drawing

13

Environmental  
Protection Regulation

 

 RoHS

 

 
C. APPEARANCE DRAWING  

C. APPEARANCE DRAWING.gif

 
Tol : ± 0.3      Unit: mm

 

D.TESTING METHOD    
Standard Measurement conditions
Temperature:25±2℃  Humidity:45-65%

Acoustic Characteristics:
The oscillation frequency, current consumption and sound pressure are measured by the 
measuring instruments shown below
D.TESTING METHOD.jpg

 
In the measuring test, buzzer is placed as follows:
D.TESTING METHOD 1.jpg


  
E. Typical Frequency Response Curve

E. Typical Frequency Response


 

F. Recommend Driving Circuit 
F. Recommend Driving Circuit.j

 

The base current Ib should high enough so that it saturates the collector current of the transistor with the CB load.

 

G. Soldering Condition
(1)Recommendable reflow soldering condition is as follows
(Reflow soldering is twice)
Note:It is requested that reflow soldering should be executed after heat of product goes down to normal.
G. Soldering Condition.gif


  Heat resistant line
(Used when heat resistant reliability test is performed)
(2)Manual soldering
   Manual soldering temperature 350 ℃ within 5 sec.

 

H. RELIABILITY TEST

NO.

ITEM

TEST ConDITION AND REQUIREMENT

1

High Temperature
Test (Storage)

After being placed in a chamber with 802℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: 10dB.

2

Low Temperature
Test (Storage)

After being Placed in a chamber with -302℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: 10dB.

3

Humidity Test

After being Placed in a chamber with 90-95% R.H. at 402℃ for 96 hours and then being placed in normal condition for 2 hours.
Allowable variation of SPL after test: 10dB.

4

Temperature Cycle
Test

The part shall be subjected to 5 cycles. One cycle shall be consist of:
 H. RELIABILITY TEST.gif


Allowable variation of SPL after test: 10dB.

5

dro Test

dro on a hard wood board of 4cm thick, any directions ,6 times, at the height of 75cm .
Allowable variation of SPL after test: 10dB.

6

Vibration Test

After being applied vibration of amplitude of 1.5mm with 10 to 55 Hz band of vibration frequency to each of 3 perpendicular directions for 2 hours .
Allowable variation of SPL after test: 10dB.

7

Solderability
Test

Lead terminals are immersed in rosin for 5 seconds and then immersed in solder bath of +3005℃ for 31 seconds .
90% min. lead terminals shall be wet with solder
(Except the edge of terminals).

8

Terminal Strength
Pulling Test

The force of 9.8N(1.0kg) is applied to each terminal in axial direction for 10 seconds.
No visible damage and cutting off.

TEST CONDITION. 
Standard Test Condition              :      a) Temperature : +5 ~ +35℃  b) Humidity : 45-85%        c) Pressure : 860-1060mbar 
Judgment Test Condition             :      a) Temperature : +25 ± 2℃   b) Humidity : 60-70%         c) Pressure : 860-1060mbar

I. PACKING STANDARD

I. PACKING STANDARD.gif


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